| FORM FACTOR
| MICROPROCESSOR & CPU
| MEMORIES
| OS
| OPERATUING TEMPERATURE
|
STAMP
30x30
| i.MX8M MINI
4x Arm® Cortex®-A53 @1.6 GHz and 1x Arm® Cortex-M4 @400 MHz, 2D GPU, 3D GPU
| LPDDR4-RAM UP TO 4GB
NOR-FLASH
Emmc up to 128GB
| Embedded Linux (Yocto Distribution)
Microsoft Windows 10 IoT Core
| -25°C to +85°C
|
SOM proprietary;
2x 80 pin High-Speed connector;
40x70
| iMX 8M mini
i.MX 8M Mini Quad ARM Cortex-A53&Cortex M4
| 2GB LPDDR4(1-4GB optional);
8GB eMMC5.1 (8-128GB optional)
| Andriod;
Linux (Yocto, Ubuntu, Debian);
Free RTOS (For M4 Core)
| 0°C to +70°C; (optional -40°C to +85°C )
|
SMARC 2.0
82x50
| i.MX8X series processor
Up to 4x Cortex®-A35 + Cortex®-M4 processor
| Up to 3 GByte RAM; FLASH ON BOARD: up to 2x 1GB Ethernet
| Yocto Linux
| Operating temperature:
-40 °C to 85 °C
|
SOM proprietary;
230 pin edge connector + 30 pin FFC;
40x71
| i.MX 8M Nano
Solo – SoloLite; Nano Dual – DualLite;
Nano Quad - QuadLite
ARM® Cortex®-A53 CPU;Cores 1, 2 or 4;Frequency 1400 or 1500 MHz;
ARM® Cortex®-M7 CPU;
Core 1 Frequency 700 MHz
| RAM from 512MB to 2GB DDR4 ;
From 4 to 64 GB eMMC QSPI NOR Flash (optional)
| Linux (Cortex®-A53 core); FREERTOS (Cortex-M7)
| 0 to 85°C for commercial version;
-40°C to 85°C for industrial version
|
SOM proprietary;
230 pin edge connector + 30 pin FFC;
40x71
| i.MX 8M Mini Solo – SoloLite;
Mini Dual – DualLite;
Mini Quad - QuadLite
ARM® Cortex®-A53 CPU; Cores 1, 2 or 4;
Frequency 1600 or 1800 MHz; ARM® Cortex®-M4 CPU;
Core 1 Frequency 400 MHz
| RAM: From 1GB to 4GB DDR4;
Flash: from 4 to 64 GB eMMC QSPI NOR Flash (optional)
| Linux (Cortex®-A53 core); FREERTOS (Cortex-M7)
| 0 to 85°C for commercial version;
-40 to 85°C for industrial version
|
SMARC 2.0
82x50
| i.MX 7 Family
Up to 2x 1 GHz Cortex® A7 + 200 MHz M4 processor
| Up to 2 GByte RAM;
flash ON BOARD 2-64 GByte eMMC 5.0
| Yocto Linux
| Operating: extended consumer -20°C to +85°C
Non-Operating: -30°C to +85°C
|
SOM proprietary 230pin;
40x71
| NXP i.MX7 Solo/Dual
ARM Cortex-A7
XP i.MX7 Solo/Dual ARM® Cortex®-A7 CPU + ARM® Cortex®-M4 CPU; Heterogeneous Multicore Processing architecture;
A7 processors Frequency up to 1200 MHz;
M4 processor Frequency 266 MHz
| RAM: Up to 2 GB DDR3L up to 1066MHZ (32 bit);
SPI Nor Flash for bootloaders;
Up to 512 MB NAND FLASH memory (optional); Up to 64 GB eMMC 5.0 (optional)
| Linux
| 0 to +70°C for Commercial version;
-20°C to +85°C
for Extended version
|
SOM proprietary 200pin;
40x67.6
| NXP i.MX7 Dual ARM Cortex-A7
NXP i.MX7 Dual ARM® Cortex®-A7 CPU + ARM® Cortex®-M4 CPU; Heterogeneous Multicore Processing architecture;
A7 processors Frequency 1000 MHz;
M4 processor Frequency 266 MHz
| RAM: Up to 4 GB DDR3L up to 1066MHZ (32 bit);
storage: QSPI Nor Flash 4 MB;
Up to 64 GB eMMC 5.0
| Linux
| 0 to +70°C for Commercial version;
-20°C to +85°C for Extended version
|
SOM iMX 7
Dual line connectors
55x47
| iMX 7
Cortex A7;
1,2GH/Cortex-M4 at 200MHz
| RAM: 1GB LPDDR3: FLASH 8GB eMMC 5.1
| Android; Linux 4.9.88_2.0.0
| -25°C +70°C
|
STAMP
25x25
| i.MX6ULL/UL
i.MX6ULL 1x Arm® Cortex®-A7 @800 MHz, i.MX6UltraLite 1x Arm® Cortex®-A7 @528 MHz
| DDR3-RAM 256 MB/up to 512 MB, NAND-Flash 256 MB/up to 512 MB, NOR-Flash 1 MB
| Embedded Linux (Yocto Distribution)
| -40°C to +85°C
|
SMARC 1.0
82x50
| i.MX 6 Family
| RAM: DDR3 up to 2 GB, memory down; FLASH: Up to 64GB NAND/eMMC on-module (Custom Option)
| Windows WEC7, Android, Linux
| Operation:
-40°C to 85 °C
|
STAMP Q29
29x29
| NXP i.MX6 Quad/Dual ARM Cortex- A9
NXP i.MX6 Quad/Dual ARM® Cortex®- A9 CPU;
CPU core 2\4; CPU Frequency 800 MHz
| RAM: Up to 2GB LPDDR2 up to 800MHZ; flash: Up to 64 GB eMMC;
SPI FLASH 2 MB (up to 64MB on request)
| Linux
| -20°C to 70°C for extended version;
-40°C to +70°C for industrial version
|
SOM proprietary 200pin;
40x71
| NXP i.MX6 Quad/Dual/DualLite/Solo
NXP i.MX6 Quad/Dual/DualLite/Solo ARM® Cortex®-A9 CPU;
CPU core 1/2/4;
CPU Frequency 800/1000/1200 MHz
| Up to 4 GB DDR3 up to 1066MHZ (32/64 bit);
storage: SPI Nor Flash 4 MB; Up to 64 GB eMMC (optional)
| Linux
| 0 to +60°C for commercial version;
-20°C to +70°C for extended version;
-40°C to +85°C for industrial version
|
| SOM proprietary 230 pin MXM + 30pin Aux + JTAG + µSD Connectors230pin; 40x71
| NXP i.MX6 Quad/Dual/DualLite/Solo
NXP i.MX6 Quad/Dual/DualLite/Solo
ARM® Cortex®-A9 CPU;
CPU core 1/2/4;
CPU Frequency 800/1000/1200 MHz
| Up to 4 GB DDR3 up to 1066MHZ (32\64 bit);Storage : Up to 512 MB NAND FLASH memory (optional); SPI FLASH 4 MB; Up to 64 GB eMMC (optional); µSD Connector (optional)
| Linux
| -20 to +70°C for extended version;
-40°C to +85°C for industrial version;
0°C to +70°C for commercial version
|
| Q7 IMX6S, IMX6D, IMX6Q, IMX6QP; 70x70
| iMX 6 family
i.MX 6Quad: Quad ARM Cortex-A9 core, up to 1.2 GHz
i.MX 6Dual: Dual ARM Cortex-A9 core, up to 1.2 GHz i.MX 6Solo: Single ARM Cortex-A9 core, up to 1 GHz
| LPDDR3 1066MHz, 1GB for 6Quad/Dual
LPDDR3 800MHz, 1GB for 6Solo 8bit SDIO
| Linux 4.9.88_2.0.0;
Android 8.0/7.1;
Windows 10 IOT
| commercial
0°C to 70°C; Industrial grade
-40°C to 85°C
|
SMARC 2.1
82x80
| ROCKCHIP RK3399(K)
CPU clocks (Cortex-A72 @ 2.0 GHz, Cortex-A53 @ 1.6 GHz), or wider temperature range between -20°C and 85°C with lower clock speeds for the CPU (A72: 1.8 GHz, A53: 1.4 GHz) and the GPU (600 MHz) | RAM: Up to 8 GByte LPDDR4 memory down; FLASH :Up to 128 GByte eMMC 5.1
| Linux operating system;
Android 10.0
| Extended commercial -20°C to 8 5°C on request: commercial 0°C - 60 °C)
|
STAMP PX30
55x55
| ROCKCHIP : PX30
Quad-Core; Cortex-A35
| RAM: DDR 1GB; Flash 8GB (16/32GB optional)
| Android;
Linux +QT; UBUNTU
| 0°C to 80°C
|
STAMP
25.4x25.4
| STM32MP157A
(2x Arm® Cortex®-A7 @650 MHz, 1x Arm® Cortex®-M4 @200 MHz, 3D GPU)
| DDR3-RAM 256/512 MByte, NAND-Flash 256/512 MByte
| Embedded Linux Yocto Distribution
| -40°C to +85 °C
|
SOM proprietary 200pin;
40x67.6
| NXP i.MX28x ARM9
NXP i.MX28, ARM926EJ-S 454 MHz CPU
| Up to 512 MB DDR2-400 RAM memory (16 bit BUS); Up to 8 GB FLASH memory
(provided by internal microSD)
| Linux;
Windows CE 6.0 or Embedded Compact 7
| -0 to +70 °C for commercial version;
-40 to +85 °C for industrial version
|
STAMP Q5
50x50
| NXP i.MX53x ARM Cortex-A8
i.MX534/i.MX535/i.MX536/i.MX537 application processor: ARM® Cortex®-A8 CPU up to 1.0 GHz NEON coprocessor Vector Floating Point unit (VFP)
| RAM: Up to 1 GB DDR3-800 SDRAM memory (32 bit BUS);
Various storage options available*: 0/256MB/512MB NAND Flash memory (bigger flash memory sizes available on request);
Optional onboard eMMC memory (start from 2GB eMMC, other sizes available on request);
Optional onboard microSD connector;
SATA port available
| Linux
| 0 to +70 °C for commercial version;
-40°C to +85°C for industrial version
|
STAMP
31x36
| Xilinx Zynq Z-7007S / Z-7010
ARM Cortex-A9 MPCore CPUs with ARM v7; CPU Dual \ Single core;CPU Dual \ Single core; NEON™ 128b SIMD coprocessor and VFPv3 per MPCore
| RAM: Up to 512MB DDR3L;
Flash : Up to 64 GB eMMC;
QSPI FLASH 16 MB (up to 64MB on request);
External microSD
| Yocto based PetaLinux
| 0 to 70°C for commercial version;
0°C to 85°C for extended version;
-40°C to 85°C for industrial version
|
| SMARC 2.1 82x50
| INTEL : 6,9,10 and 12 Watt
Intel Atom®/ Pentium®/ Celeron® series
| Up to 16 GByte LPDDR4 memory down with inband ECC support; Flashon board: up to 128 GByte eMMC (MLC)
| Windows® 10, Enterprise, Windows® 10 IoT;
Linux
| SMARC-sXEL: Commercial temperature: 0 °C to +60 °C operating,
-30°C to+85°C non-operating SMARC-sXEL E2:
Industrial temperature:
-40°C to+85°C operating,
-40°C to+85°C non-operating
|
STAMP
29,5x29,5
| CPU: Sigma Star
Cortex A7;
Dual Core processor up to 1,2 GHz
| RAM : 64MB; Flash 128MB to 2GB
| Linux
| high temperature
|